以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
But that little girl set her sights even higher - she wanted to be at the controls of a spacecraft.，详情可参考safew官方下载
人民法院裁定撤销裁决的，应当裁定终结执行。撤销裁决的申请被裁定驳回的，人民法院应当裁定恢复执行。，更多细节参见Line官方版本下载
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